Nano-Engineering Research Center

Electron Microscopy Center

Prof. Yuichi Ikuhara

We have four transmission electron microscopes (TEM), two scanning electron microscopes (SEM), and specimen preparation instruments in Nano-Engineering Research Center. With our electron microscopes, it is possible to carry out not only high-resolution (atomic-scale) observations but also chemical composition analyses with energy dispersive X-ray and/or electron energy loss spectroscopy. Besides, we have specimen preparation instruments for many different kinds of materials including metals, ceramics, organic objects, and so on, so that we can meet the demands from wide range of research fields. Our microscopy facilities can be used by wide range of users covering from beginners to experts. We accepted users from approximately one hundred and eighty research groups last year. We have also made effort to bring up electron microscopists via holding tutorial session for elemental users.

Electron Microscopy Center

Ultra High Density Three-Dimensional Integration for Next Semiconductor Devices and Applications

Research Prof. Takayuki Ohba

Aim in Ohba laboratory is to realize three-dimensional integration (3DI) for ultra high density semiconductor devices and applications for the different field industry, for instance, the rice automation plant using process knowledge in semiconductor manufacturing, which provides new marketplace for both semiconductor and agriculture. In high density 3DI, wafer stack, bumpless through-silicon-via (TSV) and ultra thinning of wafer down to 7-μm employed production type 300-mm wafer have been developed. 3DI development is carried out by the WOW Alliance since 3DI requires widespread comprehensive study including material, process tool, devices, and design. More than 30 member companies thus participate to WOW Alliance in order to meet semiconductor requirements. This is first collaborative industry-university program for worldwide operation and development using practical 300-mm wafer and total integration. Process integration technology applied to the rice plant is how to maximize products such as everyday out coming rice product. Rice plant will be adapted and controlled by new 3D device and sensor technology.


Heterogeneous Materials Integration Technology for Post-Silicon Devices

Assoc. Prof. Masakazu Sugiyama

Super Cleanroom in Takeda Bldg.

Assoc. Prof. Masakazu Sugiyama

Hyperfine Lithography, Nano Characterization Center

Assoc. Prof. Masakazu Sugiyama

Laser Alliance

Assoc. Prof. Yuichiro Kato